Solar Cells Laser Cutting Machine
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Telephone: 86-10-82895922
Phone: 86-13910058345
13911547331
Address: Room 206, Building 2 , No:19 Jiancaicheng Middle Road, Xisanqi Haidian District , Beijing ,China,100096
Email: sales@boaolaser.com
andy@boaolaser.com

Solar Cells Laser Cutting Machine

This solar cells laser cutting machine is designed by BOAO laser and special for the solar cells laser scribing and cutting application .
Laser type : 20 W, 30W ,50W FIBER LASER
Cutting size : 300x300mm ( or as request )

Quantity:

未标题-23拷贝

Equipment performance

This machine adopts the Fiber laser, it has the characters of higher integrative degree, best quality of laser beam, lower running cost and little maintenance during long time. Imported key spare parts, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24 hours.

Applicable fields

Scribing for the mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystalline sillicon, solar cell, wafer in solar industry.

Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.

Product Features:

Fiber Laser Scribing machine belong to the highest top level products of Lasers. It has the features such as high quality, competitive price ,Low in process cost, best cutting effects, Reliability etc.

Entire Modular Design:

Fiber laser source has the corresponding independent movement space, Mutually connect simply and directly .Maximum reduce the electromagnetism interference and Heat interference and has guarantee the system long time operation stability.

Professional Laser Cavity design :

Fiber laser technology guarantee the maximum optical efficiency and best laser pattern. At the same time ,it may reduce the temperature dependence .

Installation : It may install the assembly production line ,excellent marking with high performance


Technical Parameters;

Type specification
Fiber laser /20W/30W/50W
Laser wavelength
1064nm
Scriber precision
≤±10μm
Max scriber thickness
1.2mm-1.5MM
Scriber line width
≤30μm
Laser repetition frequency
200Hz~50kHz
Max scriber speed
150mm/s    / 180mm/s
Scribing accuracy
±10μm
Laser max power
≥20W   /≥30W/≥50W
Work platform size
300x300mm
Power supply
220V(220V)/50Hz/1kvA
Cooling system
Air cooling system
Work platform
The adsorption of vacuum pump on two dimension programmed moving platform.


Application & Materials:

Scribing for the mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystalline sillicon, solar cell, wafer in solar industry.
Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.


wafer laser cutting samples

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 Add: Room 206/207/208/209. Building 2, No:19 Jiancaicheng Middle Road, Xisanqi Haidian District, Beijing, China, 100096
 Tel: 86-10-82895922 Fax:86-10-82895923
 MB: 86-13911547331  13910058345
 E-mail: sales@boaolaser.comandy@boaolaser.com