UV Laser Marking Machine

Description

Simple Introduction


Focused UV light spot size is small , heat-affected area during processing is mimimum, so it is used in ultra-fine and special material’s marking. Since UV laser did not produce any thermal effects and burning issues, the result of the marking is precise, smooth and steep. A lot of material will absorb UV light at 355nm except copper, so UV laser are suitable for processing more types of material. 


Features


1. High peak power but much less thermal effect.
2. Micro-meter or nanometer level super-fining processing.
3. Widespread applications: high absorption rate by various materials.
4. Dust-proof sealed laser cavity without condensation.
5. Much less power consumption: occupy traditional consumption of one-tenth.
6. High-speed: the speed is three to five times faster than traditonal machine.
7. Good beam Stability.
8. Long life with no maintenace.
9. Able to process multidimensional workpieces.


Advantages


Due to smallest focal spot and little affect area, UV laser could process super-precision marking and special material marking and will be the preferred product for strict requirement of the marking effect. Without heat effect, the effect of laser marking and cutting is precise, smooth and steep. Except copper, 355nm UV laser could be absorbed by many materials, so it is suitable for manufacture more material type.


Parameter

Technical Parameters

Laser type
Ultraviolet laser (UV laser)
 Beam quality
≥90%
 Laser power
10W
 Laser wavelength
355nm
 Working material
ND:YVO4
 Beam mode
TEM00(≤1.2)
 Working area
100mm×100mm
 Max marking speed
≤12000mm/s
 Min line width
0.01mm
 Min spot diameter
15um
 Beam divergence
Mrad<2
 Min character
0.15mm
 Beam stability
Rms≤3%
 Repeat accuracy
±0.003mm
 Pulse frequency
20KHz-200KHz
 Electricity demand
220v/50Hz/10A
 Cooling system
Water cooling


Application

Application & Materials


Main used for all kinds of glass, tft, lcd, plasma screens, textiles, thin ceramic, silicon, ic crystal, sapphire, polymers, food, drug, cosmetic, polymer materials such as wire, bottles (boxes) surface marking, and micro-holes.

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