Silicon Wafer Laser Cutting
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Beijing Boao Laser Technology C.,Ltd.
T:  86-10-82895922
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Address: Room 206/207/208/209, Building 2 , No:19 Jiancaicheng Middle Road, Xisanqi Haidian District , Beijing ,China,100096

Silicon Wafer Laser Cutting

Views: 30     Author: Site Editor     Publish Time: 2018-07-18      Origin: Site

Silicon Wafer Laser Cutting

Silicon wafer is one of the most important compents of solar industry. Smooth cutting edge, fast cutting speed are the feathers of laser wafer cutting machine

wafer laser cutting samples

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 Add: Room 206/207/208/209. Building 2, No:19 Jiancaicheng Middle Road, Xisanqi Haidian District, Beijing, China, 100096
 Tel: 86-10-82895922 Fax:86-10-82895923
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