Solar Cells Laser Cutting Machine
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Beijing Boao Laser Technology C.,Ltd.
T:  86-10-82895922
M: 86-13910058345(Wechat&WhatsApp)
     86-13911547331
Address: Room 206/207/208/209, Building 2 , No:19 Jiancaicheng Middle Road, Xisanqi Haidian District , Beijing ,China,100096
Email: sales@boaolaser.com
           andy@boaolaser.com

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Solar Cells Laser Cutting Machine

  • This solar cells laser cutting machine is designed by BOAO laser and special for the solar cells laser scribing and cutting application.
  • Laser type : 20 W, 30W ,50W FIBER LASER 
  • Cutting size : 300x300mm ( or as request )
Availability:
Quantity:

未标题-23拷贝

Equipment performance

This machine adopts the Fiber laser, it has the characters of higher integrative degree, best quality of laser beam, lower running cost and little maintenance during long time. Imported key spare parts, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24 hours.


Applicable fields

Scribing for the mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystalline sillicon, solar cell, wafer in solar industry.

Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.


Product Features

Fiber Laser Scribing machine belong to the highest top level products of Lasers. It has the features such as high quality, competitive price ,Low in process cost, best cutting effects, Reliability etc.


Entire Modular Design

Fiber laser source has the corresponding independent movement space, Mutually connect simply and directly .Maximum reduce the electromagnetism interference and Heat interference and has guarantee the system long time operation stability.


Professional Laser Cavity design

Fiber laser technology guarantee the maximum optical efficiency and best laser pattern. At the same time ,it may reduce the temperature dependence .

Installation : It may install the assembly production line ,excellent marking with high performance


Technical Parameters

Type specification
Fiber laser /20W/30W/50W
Laser wavelength
1064nm
Scriber precision
≤±10μm
Max scriber thickness
1.2mm-1.5MM
Scriber line width
≤30μm
Laser repetition frequency
200Hz~50kHz
Max scriber speed
150mm/s    / 180mm/s
Scribing accuracy
±10μm
Laser max power
≥20W   /≥30W/≥50W
Work platform size
300x300mm
Power supply
220V(220V)/50Hz/1kvA
Cooling system
Air cooling system
Work platform
The adsorption of vacuum pump on two dimension programmed moving platform.


Application & Materials


Scribing for the mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystalline sillicon, solar cell, wafer in solar industry.
Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.


wafer laser cutting samples

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BEIJING BOAO OFFICE 
Add: Room 206/207/208/209. Building 2, No:19 Jiancaicheng Middle
 SHANDDONG BOAO OFFICE 
Add:1911/1912 DingCheng Building ,Zhangdian,Zibo,Shandong China .
  TIANJIN BOAO&MINTEC LASER FACTORY
Add: 33 ,St.Guangyuan,Wuqing,Tianjin ,China 
TIANJIN BOAO&ULTRA LASER FACTORY 
Add:3 St.Tongwang,Wangqingtuo,Tianjin ,China
ZHENGZHOU BOAO LASER PARK
Add:Boao Laser Park,Zhongmu , Zhengzhou ,China .
 Tel: 86-10-82895922 Fax:86-10-82895923
 MB: 86-13911547331  13910058345
 E-mail: sales@boaolaser.comandy@boaolaser.com