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BFC
BOAO
Dual Platform Picosecond Laser Glass Cutting and Splitting Machine
➤ Machine Photo
Picosecond ultra-fast glass laser cutting machine, equipped with self-developed AI control system, with high-end customised picosecond light source and dual-drive linear motor, marble table top is stable and durable. Its cutting and cracking in one process, high precision, cutting error ± 2 microns.
Compared with traditional CNC and waterjet processing, it has significant advantages, especially in the field of shaped, fine and non-destructive cutting. Laser cutting is characterised by non-contact operation, convenient operation, fully automatic operation, no consumables, no pollution, smooth edges and no chipping, low power consumption and high efficiency, with a peak cutting speed of up to 15m/min.
Light source for high-power picosecond laser; self-developed glass cutting head, all imported lenses, spot fine, long depth of focus; X / Y-axis motor using high-end linear motors, Germany 0.1um digital scale; support for cutting splitting as a whole, a separate cut, a separate splitting; motion control comes standard with the PS0 function, uniform control of the laser spot spacing; device to align the CCD and telecentric vision lenses, accurate identification of the circle, Cross and other mark points; electrical components using France Schneider, switching power supply using Taiwan Meanwell; Cutting thickness up to 19mm or less in one cut; motor platform, optical platform base using natural marble, the precision is more guaranteed.
➤ Machines Worktable
Dual Platform Picosecond Laser Glass Cutting and Splitting Machine
➤ Machine Photo
Picosecond ultra-fast glass laser cutting machine, equipped with self-developed AI control system, with high-end customised picosecond light source and dual-drive linear motor, marble table top is stable and durable. Its cutting and cracking in one process, high precision, cutting error ± 2 microns.
Compared with traditional CNC and waterjet processing, it has significant advantages, especially in the field of shaped, fine and non-destructive cutting. Laser cutting is characterised by non-contact operation, convenient operation, fully automatic operation, no consumables, no pollution, smooth edges and no chipping, low power consumption and high efficiency, with a peak cutting speed of up to 15m/min.
Light source for high-power picosecond laser; self-developed glass cutting head, all imported lenses, spot fine, long depth of focus; X / Y-axis motor using high-end linear motors, Germany 0.1um digital scale; support for cutting splitting as a whole, a separate cut, a separate splitting; motion control comes standard with the PS0 function, uniform control of the laser spot spacing; device to align the CCD and telecentric vision lenses, accurate identification of the circle, Cross and other mark points; electrical components using France Schneider, switching power supply using Taiwan Meanwell; Cutting thickness up to 19mm or less in one cut; motor platform, optical platform base using natural marble, the precision is more guaranteed.
➤ Machines Worktable
MODEL | Dual Platform Picosecond Laser Glass Cutting and Splitting Machine | |
LASER TYPE | Infrared Picosecond Laser Source | |
LASER POWER | 80W | |
WAVELENGTH | 1064nm, Beam quality: M2<1.2 | |
Water Cooling | ||
DRIVE MOTORS | XY linear motor + scale, positioning accuracy ≤ ± 2um, repeatability ≤ ± 1.5um, acceleration 1G, linear speed up to 1000mm/s. | |
CUTTING SPEED | 0-500mm/s adjustable | |
CUTTING THICKNESS | Ultra-white glass one cut ≤ 19mm, green glass two cuts ≤ 19mm (according to the product material, thickness, speed requirements for the selection of the required laser power and cutting head depth of focus: the material may affect the thickness of the processing, the thicker can be taken to the multi-knife cutting system) | |
MINI CUTTING CHIPPING | ≤5um | |
CUTTING ACCURACY | <20um | |
X/Y MOVEMENT | 600x600mm*2 DUAL PLATFORM | |
LASER TYPE | co2 CW Laser Source | |
POWER | 200W (250W/350W OPTIONAL) | |
WAVELENGTH | 10.6um | |
PULSE LENGTH | 1-100kHz | |
COOLING SYSTEM | WATER COOLING | |
VOLTAGE POWER | <8KW.AC220V | |
MACHINE SIZE | LENGTH 2150mm x WIDTH 2080mm x HEIGHT 1960mm | |
Dual Platform Picosecond Laser Glass Cutting and splitting Machine | ||
WEIGHT | AROUND 4000KG | |
GROUND BEARING | >700kg/m2 |
MODEL | Dual Platform Picosecond Laser Glass Cutting and Splitting Machine | |
LASER TYPE | Infrared Picosecond Laser Source | |
LASER POWER | 80W | |
WAVELENGTH | 1064nm, Beam quality: M2<1.2 | |
Water Cooling | ||
DRIVE MOTORS | XY linear motor + scale, positioning accuracy ≤ ± 2um, repeatability ≤ ± 1.5um, acceleration 1G, linear speed up to 1000mm/s. | |
CUTTING SPEED | 0-500mm/s adjustable | |
CUTTING THICKNESS | Ultra-white glass one cut ≤ 19mm, green glass two cuts ≤ 19mm (according to the product material, thickness, speed requirements for the selection of the required laser power and cutting head depth of focus: the material may affect the thickness of the processing, the thicker can be taken to the multi-knife cutting system) | |
MINI CUTTING CHIPPING | ≤5um | |
CUTTING ACCURACY | <20um | |
X/Y MOVEMENT | 600x600mm*2 DUAL PLATFORM | |
LASER TYPE | co2 CW Laser Source | |
POWER | 200W (250W/350W OPTIONAL) | |
WAVELENGTH | 10.6um | |
PULSE LENGTH | 1-100kHz | |
COOLING SYSTEM | WATER COOLING | |
VOLTAGE POWER | <8KW.AC220V | |
MACHINE SIZE | LENGTH 2150mm x WIDTH 2080mm x HEIGHT 1960mm | |
Dual Platform Picosecond Laser Glass Cutting and splitting Machine | ||
WEIGHT | AROUND 4000KG | |
GROUND BEARING | >700kg/m2 |
Cutting Samples
Cutting Samples